Russia to Mass-Produce Irtysh Processor Packaging With Private Investment

Russia is preparing for the serial packaging of Irtysh processors, a project backed entirely by private funding. Tramplin Electronics, MIET, and ZNTC have signed an agreement to jointly develop the technology required for this work. The initiative goes beyond setting up production and includes creating a full set of engineering solutions for assembling complex microchips.

The project involves BGA and LGA packages using the flip-chip method, where the die is mounted upside down. Each processor contains multiple dies and more than ten thousand interconnects, making the assembly process especially demanding. Heat dissipation relies on specialized lids with a metallic thermal interface.

Research and engineering tasks will be handled by MIET's laboratory for advanced packaging technologies. The production site is planned for a new facility operated by ZNTC. The team must design process flows, tooling, methods for connecting dies to the package, and adapt materials for use under Russian manufacturing conditions.

According to the initiators, microchips of comparable complexity have never been mass-produced in the country before, though domestic companies already hold some capabilities for assembling high-performance chips. Funding for the development and launch will come entirely from private investment by Tramplin Electronics. The company expects the project to strengthen local packaging expertise, introduce new materials, and reduce the industry's reliance on foreign technology.

Previous attempts to establish chip packaging in Russia were made several times, but none reached the mass production stage. The current partners now hope to break through that barrier by combining scientific and industrial efforts.